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Conference Papers Year : 2015

Next generation image sensor via direct hybrid bonding

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cea-02156720 , version 1 (14-06-2019)

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  • HAL Id : cea-02156720 , version 1

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L. Benaissa, L. Di Cioccio, Y. Beilliard, P. Coudrain, S. Dominguez, et al.. Next generation image sensor via direct hybrid bonding. 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Dec 2015, Singapore, France. pp.1-3. ⟨cea-02156720⟩
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