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From epitaxy to converters topologies what issues for 200 mm GaN/Si?
L. Di Cioccio
,
E. Morvan
,
M. Charles
,
P. Perichon
,
A. Torres
,
et al.
2015 IEEE International Electron Devices Meeting (IEDM), Dec 2015, Washington, DC, United States. pp.16.5.1-16.5.4, ⟨10.1109/IEDM.2015.7409712⟩
Conference papers
cea-01839849v1
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Direct bonding of titanium layers on silicon
F. Baudin
,
L. Di Cioccio
,
V. Delaye
,
N. Chevalier
,
J. Dechamp
,
et al.
Journal articles
istex
hal-00850233v1
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Surface potential fluctuations in metal–oxide–semiconductor capacitors fabricated on different silicon carbide polytypes
Edwige Bano
,
T. Ouisse
,
L. Di Cioccio
,
S. Karmann
Journal articles
hal-01957709v1
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A new extraction method for estimating the bonding quality of metal bonding wafers.
F.Y. Liu
,
L. Di Cioccio
,
I. Ionica
,
Y. Guo
,
S. Cristoloveanu
EuroSOI 2013, Jan 2013, Paris, France. pp.P1.1
Conference papers
hal-01068000v1
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TEM characterization of high superconductive multilayered thin films
A. Alimoussa
,
Marie-José Casanove
,
Christian Roucau
,
C. Villard
,
M. Schwerdtfeger
,
et al.
Journal articles
istex
hal-02918331v1
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Next generation image sensor via direct hybrid bonding
L. Benaissa
,
L. Di Cioccio
,
Y. Beilliard
,
P. Coudrain
,
S. Dominguez
,
et al.
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Dec 2015, Singapore, France. pp.1-3
Conference papers
cea-02156720v1
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Copper Direct Bonding: an innovative 3D interconnect
L. Di Cioccio
,
P. Morfouli
,
M. Zussy
,
J. Dechamp
,
L. Bally
,
et al.
59th Electronic Components and Technology Conference,, Jun 2010, Las Vegas, United States
Conference papers
hal-00604278v1
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Thermomechanical finite element modeling of Cu–SiO 2 direct hybrid bonding with a dishing effect on Cu surfaces
Y. Beilliard
,
R. Estevez
,
G. Parry
,
P. Mcgarry
,
L. Di Cioccio
,
et al.
Journal articles
hal-01685170v1
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Lattice performance during initial steps of the Smart-Cut™ process in semiconducting diamond: A STEM study
J.C. Piñero
,
J. de Vecchy
,
D. Fernández
,
G. Alba
,
J. Widiez
,
et al.
Journal articles
hal-04094901v1
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Stabilization of the tilt motion during capillary self-alignment of rectangular chips
J. Berthier
,
K.A. Brakke
,
S. Mermoz
,
Christian Frétigny
,
L. Di Cioccio
Journal articles
hal-01468271v1
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Modeling and Integration Phenomena of metal-metal direct bonding technology
L. Di Cioccio
,
F. Baudin
,
P. Gergaud
,
V. Delaye
,
Pierre-Henri Jouneau
,
et al.
Journal articles
hal-02016543v1
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Evaluation of Titanium Direct Bonding MechanismStudy of crystal-crucible detachment: GaSb in SiO2
F. Baudin
,
V. Delaye
,
C. Guedj
,
N. Chevalier
,
D. Mariolle
,
et al.
Journal articles
hal-00850213v1
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Novel low temperature 3D wafer stacking technology for high density device integration
I. Radu
,
G. Gaudin
,
W. van den Daele
,
F. Letertre
,
C. Mazure
,
et al.
Conference papers
hal-01021831v1
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Twin free growth of II–VI compounds on (111) CdZnTe substrates by molecular beam epitaxy
L. Di Cioccio
,
A. Million
,
J. Piaguet
,
G. Rolland
,
G. Lentz
,
et al.
Journal articles
istex
hal-04144290v1
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