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authFullName_s : L. Di Cioccio

From epitaxy to converters topologies what issues for 200 mm GaN/Si?

L. Di Cioccio , E. Morvan , M. Charles , P. Perichon , A. Torres , et al.
2015 IEEE International Electron Devices Meeting (IEDM), Dec 2015, Washington, DC, United States. pp.16.5.1-16.5.4, ⟨10.1109/IEDM.2015.7409712⟩
Conference papers cea-01839849v1

Direct bonding of titanium layers on silicon

F. Baudin , L. Di Cioccio , V. Delaye , N. Chevalier , J. Dechamp , et al.
Microsystem Technologies, 2013, 19 (5), pp.647-653. ⟨10.1007/s00542-012-1664-0⟩
Journal articles istex hal-00850233v1

Surface potential fluctuations in metal–oxide–semiconductor capacitors fabricated on different silicon carbide polytypes

Edwige Bano , T. Ouisse , L. Di Cioccio , S. Karmann
Applied Physics Letters, 1994, 65 (21), pp.2723-2724. ⟨10.1063/1.112547⟩
Journal articles hal-01957709v1

A new extraction method for estimating the bonding quality of metal bonding wafers.

F.Y. Liu , L. Di Cioccio , I. Ionica , Y. Guo , S. Cristoloveanu
EuroSOI 2013, Jan 2013, Paris, France. pp.P1.1
Conference papers hal-01068000v1

TEM characterization of high superconductive multilayered thin films

A. Alimoussa , Marie-José Casanove , Christian Roucau , C. Villard , M. Schwerdtfeger , et al.
Materials Science and Engineering: B, 1992, 14 (4), pp.353-356. ⟨10.1016/0921-5107(92)90074-J⟩
Journal articles istex hal-02918331v1

Next generation image sensor via direct hybrid bonding

L. Benaissa , L. Di Cioccio , Y. Beilliard , P. Coudrain , S. Dominguez , et al.
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), Dec 2015, Singapore, France. pp.1-3
Conference papers cea-02156720v1

Copper Direct Bonding: an innovative 3D interconnect

L. Di Cioccio , P. Morfouli , M. Zussy , J. Dechamp , L. Bally , et al.
59th Electronic Components and Technology Conference,, Jun 2010, Las Vegas, United States
Conference papers hal-00604278v1

Thermomechanical finite element modeling of Cu–SiO 2 direct hybrid bonding with a dishing effect on Cu surfaces

Y. Beilliard , R. Estevez , G. Parry , P. Mcgarry , L. Di Cioccio , et al.
International Journal of Solids and Structures, 2017, 117, pp.208 - 220. ⟨10.1016/j.ijsolstr.2016.02.041⟩
Journal articles hal-01685170v1

Lattice performance during initial steps of the Smart-Cut™ process in semiconducting diamond: A STEM study

J.C. Piñero , J. de Vecchy , D. Fernández , G. Alba , J. Widiez , et al.
Applied Surface Science, 2020, 528, pp.146998. ⟨10.1016/j.apsusc.2020.146998⟩
Journal articles hal-04094901v1

Stabilization of the tilt motion during capillary self-alignment of rectangular chips

J. Berthier , K.A. Brakke , S. Mermoz , Christian Frétigny , L. Di Cioccio
Sensors and Actuators A: Physical , 2015, 234, pp.180 - 187. ⟨10.1016/j.sna.2015.09.008⟩
Journal articles hal-01468271v1

Modeling and Integration Phenomena of metal-metal direct bonding technology

L. Di Cioccio , F. Baudin , P. Gergaud , V. Delaye , Pierre-Henri Jouneau , et al.
ECS Transactions, 2014, 64 (5), pp.339-355. ⟨10.1149/06405.0339ecst⟩
Journal articles hal-02016543v1

Evaluation of Titanium Direct Bonding MechanismStudy of crystal-crucible detachment: GaSb in SiO2

F. Baudin , V. Delaye , C. Guedj , N. Chevalier , D. Mariolle , et al.
ECS Journal of Solid State Science and Technology, 2013, 2 (5), pp.N115-N119. ⟨10.1149/2.015305jss⟩
Journal articles hal-00850213v1

Novel low temperature 3D wafer stacking technology for high density device integration

I. Radu , G. Gaudin , W. van den Daele , F. Letertre , C. Mazure , et al.
43rd ESSDERC, Sep 2013, Bucarest, Romania. pp.151-154, ⟨10.1109/ESSDERC.2013.6818841⟩
Conference papers hal-01021831v1

Twin free growth of II–VI compounds on (111) CdZnTe substrates by molecular beam epitaxy

L. Di Cioccio , A. Million , J. Piaguet , G. Rolland , G. Lentz , et al.
Journal of Crystal Growth, 1989, 95 (1-4), pp.552-556. ⟨10.1016/0022-0248(89)90464-8⟩
Journal articles istex hal-04144290v1