Key low temperature processes for a silicon-based 3D sequential integration - CEA - Commissariat à l’énergie atomique et aux énergies alternatives Access content directly
Conference Papers Year : 2022

Dates and versions

cea-03727300 , version 1 (11-10-2022)

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  • HAL Id : cea-03727300 , version 1

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Xavier Garros, Perrine Batude, Claire Fenouillet-Beranger, Laurent Brunet, Camila Calvacante, et al.. Key low temperature processes for a silicon-based 3D sequential integration. 2022 IEEE SYMPOSIUM ON VLSI TECHNOLOGY AND CIRCUITS, Jun 2022, Honolulu, United States. ⟨cea-03727300⟩
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