Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power Electronics
Résumé
This paper presents a wafer-level pre-packaging
technology for power devices. The concept consists in the
implementation of a thick 3D patterned copper leadframe
ensuring the interconnections of the power devices among
them or with the other components of the converter. The
metallic leadframe is bonded between two wafers of
semiconductor devices enabling the 3D power module
integration by the 3D stacking of one or multiple switching
cells. Specific technology developments are introduced,
practical realizations of the concept are presented and the
electrical characterizations of the first prototypes are
discussed