Known Good Dies (KGD) strategies compatible with Direct Hybrid bonding - Laboratoire d'Electronique et des Technologies de l'Information
Conference Papers Year : 2020

Known Good Dies (KGD) strategies compatible with Direct Hybrid bonding

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Engineering Sciences [physics] Micro and nanotechnologies/Microelectronics
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https://cea.hal.science/cea-03759970

Submitted on : Monday, September 16, 2024-10:38:28 AM

Last modification on : Tuesday, September 17, 2024-3:21:26 AM

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cea-03759970 , version 1 (16-09-2024)

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  • HAL Id : cea-03759970 , version 1

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E Bourjot, P Stewart, C Castan, L Sanchez, G Mauguen, et al.. Known Good Dies (KGD) strategies compatible with Direct Hybrid bonding. 7th IEEE International Workshop on Testing 3D Stacked, Chiplet-Based, and Stacked ICs, Nov 2020, Virtuelle, United States. ⟨cea-03759970⟩

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