Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development
Abstract
Die-to-wafer stacking is very promising for the next 3DIC generation since it offers the ability to assemble several dies with small interconnection pitches. This paper proposes an overall integration scheme D2W HB process to reinforce its robustness and its economical relevance for microelectronics industry. Firstly, a KGD strategy was developed to be compatible with hybrid bonding. A successful D2W bonding was demonstrated with tested pads. Secondly, the development of the planarization of stacked dies is presented.