Characterization, Modeling, and Reliability for Direct Copper Interconnection
Résumé
In advanced packaging, as newer forms of interconnects emerge to meet the demand for high density and high performance, interconnect reliability becomes more complex and more critical. Hybrid bonding and chiplets present new topics for the long-term reliability of the interconnect and the system. This chapter will outline and discuss the key reliability issues in advanced packaging and direct copper interconnection, including failure modes and mechanisms, reliability testing, and performance. The most recent results of reliability testing and studies will be reviewed.
Simulation and modeling have been used extensively for characterization and optimization of processes and performance for advanced semiconductor packaging. Progress in the development of modeling methodology and significant simulation results will be reviewed as related to the direct copper interconnection process and the performance (electrical, thermal, and reliability) of the hybrid bonding interconnects.
A thorough understanding of failure modes and mechanisms, as well as reliability testing, in combination with computer modeling and simulation, are critical elements to ensure quality and reliability of advanced packaging for semiconductor devices using hybrid bonding interconnects.