A 57.6 Gb/s wireless link based on 25.4 dBm EIRP D-band transmitter module and a channel bonding chipset on CMOS 45nm
Résumé
This paper presents a baseband to D-band wireless link based on a transmitter module integrating a CMOS 45nm channel bonding chipset and a high-gain antenna implemented on PCB technology. The link achieves 57.6 Gb/s data rate using multi-channel 16-QAM and a link efficiency of 65 pJ/b/m.
Origine | Fichiers produits par l'(les) auteur(s) |
---|