Vertical current temperature analysis of GaN-on-Si epitaxy through analytical modelling - CEA - Commissariat à l’énergie atomique et aux énergies alternatives
Communication Dans Un Congrès Année : 2022

Vertical current temperature analysis of GaN-on-Si epitaxy through analytical modelling

Résumé

The current temperature dependence of a 3.9 μm GaN-on-Silicon epitaxy at temperatures ranging from 25 °C to 200 °C and for voltages beneath the plateau limited by the carrier generation in the p-doped substrate is analyzed. Based upon a fit with analytical transport models, the vertical current is reported for the first time to be the superposition of three different transport mechanisms: Recombination limited at low and middle voltages for low temperatures, Ohmic at low and middle voltages for high temperatures and Nearest Neighbor Hopping (NNH) at high voltages. Thanks to their temper-ature dependences and therefore to their energy, the transports can be related to either point defects clustered around threading dislocations or to interstitial nitrogen.

Domaines

Electronique
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Dates et versions

cea-03875079 , version 1 (28-11-2022)

Identifiants

  • HAL Id : cea-03875079 , version 1

Citer

Florian Rigaud-Minet, Julien Buckley, William Vandendaele, Stéphane Becu, Matthew Charles, et al.. Vertical current temperature analysis of GaN-on-Si epitaxy through analytical modelling. SSDM 2022 - 2022 International conference on solid state devices and materials, Sep 2022, Chiba, Japan. ⟨cea-03875079⟩
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