The removal of particle contamination is key to maximize yield. Some common particle removal techniques are not relevant anymore when complex and fragile structures are present on the surface. This led to the development of new cleaning processes based on innovative concepts to improve particle removal efficiency without any pattern damage. Some of these processes rely on a resist film lift off. One of these particle removal processes is studied in this paper. The process consists in some resist spin-coating followed by a diluted ammonia dispense to remove this film, which results in particle removal. This specific resist film is made of two immiscible organic polymers. A study was conducted to understand how the organization of these two polymers in the film is key for the film lift-off and the cleaning efficiency. This organization was shown to depend on the substrate contact angle and the resist formulation. A surface preparation is required on hydrophobic surface to reduce their water contact angle and ensure the efficiency of the process. As a result, compared to a high velocity aerosol cleaning technique, this resist peeling process requires multiple steps and a significant process time. A Particle Removal Efficiency study was then performed on blanket wafers to determine and understand how the different process parameters impacted on the cleaning efficiency. It led to the optimization of this process efficiency on blanket wafers. A comparison between an optimized process and a high velocity aerosol cleaning technique underlined the potential of such a process. Compared to high velocity aerosol cleaning, it demonstrated higher efficiency on blanket wafers, without causing any pattern damage on patterned wafers. These results lead to promising perspectives for using this process in the cleaning of fragile structure or targeting small particles with high adhesion.