The photovoltaic industry is reaching an inflection point to become a major source of energy. Optimizing its environmental impact is becoming a lever of industrial competitiveness to maintain the sector's growth and to meet societal challenges. Committed to this approach for several years, our paper presents the development of heterojunction module (HJT) with exemplary power and reliability with significantly reduced environmental impact and components sourced from Europe. In order to guide the technology choice in the design phase, a Life Cycle Assessment sensitivity study was performed. This led us to act on the most critical lines of the carbon footprint, namely the silicon wafers, the glass front panel and the aluminum frame. The reduction of the carbon footprint at the cell scale is achieved by reducing the thickness of the wafers issued from the entirely European value chain. Optimization of metallization and cell interconnection has limited the consumption of silver, a critical raw metal. At the module level, the reduction of glass thickness and the replacement of the aluminum frame with a low carbon frame have been implemented in a glass-backsheet module configuration. In addition, a "design for recycle" approach was implemented for the choice of encapsulant and backsheet. The combination of these innovations led us to the realization of a 566 Wp module based on a GapLess interconnection, paving type, cells with an average efficiency of 22.9% with a carbon footprint of 317 kgCO2eq/kWp.