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Efficiency of reducing and oxidizing ash plasmas in preventing metallic barrier diffusion into porous SiOCH

N. Posseme , T. Chevolleau , T. David , Maxime Darnon , J.P. Barnes , et al.
Microelectronic Engineering, 2008, 85, pp.1842-1849
Journal articles hal-00387514v1

From epitaxy to converters topologies what issues for 200 mm GaN/Si?

L. Di Cioccio , E. Morvan , M. Charles , P. Perichon , A. Torres , et al.
2015 IEEE International Electron Devices Meeting (IEDM), Dec 2015, Washington, DC, United States. pp.16.5.1-16.5.4, ⟨10.1109/IEDM.2015.7409712⟩
Conference papers cea-01839849v1

New ash challenges for porous low k : trade off between film modification and k value increasing

T. Chevolleau , N. Posseme , T. David , L. Vallier , P. Meininger , et al.
DPS, Symposium on Dry Process, 2004, Tokyo, Japan
Conference papers hal-00485193v1