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authFullName_s : V. Larrey

Transmission measurements of multilayer interference filters developed for a full integration on Complementary Metal Oxide Semiconductor chips

L. Masarotto , L. Frey , M. L. Charles , A. Roule , G. Rodriguez , et al.
Thin Solid Films, 2017, 631, pp.23-28. ⟨10.1016/j.tsf.2017.03.055⟩
Journal articles cea-02202452v1

Direct Bonding Mechanism of ALD-Al 2 O 3 Thin Films

E. Beche , F. Fournel , V. Larrey , F. Rieutord , C. Morales , et al.
ECS Journal of Solid State Science and Technology, 2015, 4 (5), pp.P171-P175
Journal articles hal-02016525v1

Water Stress Corrosion in Bonded Structures

F. Fournel , C. Martin-Cocher , D. Radisson , V. Larrey , E. Beche , et al.
ECS Journal of Solid State Science and Technology, 2015, 4 (5), pp.P124-P130. ⟨10.1149/2.0031505jss⟩
Journal articles hal-02016558v1

Adhesion Energy and Bonding Wave Velocity Measurements

V. Larrey , G. Mauguen , F. Fournel , D. Radisson , F. Rieutord , et al.
PRIME 2016, Oct 2016, Honolulu, United States. pp.145-152, ⟨10.1149/07509.0145ecst⟩
Conference papers hal-01974477v1

First demonstration of a back-side integrated heterogeneous hybrid III-V/Si DBR lasers for Si-photonics applications

J. Durel , B. Ben Bakir , C. Jany , S. Cremer , B. Szelag , et al.
2016 IEEE International Electron Devices Meeting (IEDM), Dec 2016, San Francisco, United States. pp.22.2.1-22.2.4, ⟨10.1109/IEDM.2016.7838471⟩
Conference papers hal-02019672v1

Direct Bonding Mechanism of ALD-Al2O3 Thin Films

E. Beche , F. Fournel , V. Larrey , F. Rieutord , C. Morales , et al.
13th International Symposium on Semiconductor Wafer Bonding - Science, Technology and Applications as part of the 226th Meeting of the Electrochem Soc, ECS, Oct 2014, Cancun, Mexico. pp.57-65, ⟨10.1149/06405.0057ecst⟩
Conference papers hal-02015924v1

Back-side integration of Hybrid III–V on Silicon DBR lasers

J. Durel , B. Ben Bakir , C. Jany , S. Cremer , K. Hassan , et al.
2017 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), Apr 2017, Hsinchu, Taiwan. pp.1-2, ⟨10.1109/VLSI-TSA.2017.7942492⟩
Conference papers hal-02019688v1

Interface water diffusion in silicon direct bonding

M. Tedjini , Frank Fournel , Hubert Moriceau , V. Larrey , Didier Landru , et al.
Applied Physics Letters, 2016, 109 (11), pp.111603. ⟨10.1063/1.4962464⟩
Journal articles cea-01851936v1

Edge Water Penetration in Direct Bonding Interface

F. Rieutord , S. Tardif , D. Landru , O. Kononchuk , V. Larrey , et al.
PRiME 2016/230th ECS Meeting, Electrochemical Society, Oct 2016, Honolulu, United States. pp.163-167, ⟨10.1149/07509.0163ecst⟩
Conference papers hal-02016077v1

(Invited) Water Stress Corrosion in Bonded Structures

F. Fournel , C. Martin-Cocher , D. Radisson , V. Larrey , E. Beche , et al.
13th International Symposium on Semiconductor Wafer Bonding - Science, Technology and Applications as part of the 226th Meeting of the Electrochem Soc, Oct 2014, Cancun, Mexico. pp.121-132
Conference papers hal-02015940v1

Impact of Water Edge Absorption on Silicon Oxide Direct Bonding Energy

F. Fournel , M. Tedjini , V. Larrey , F. Rieutord , C. Morales , et al.
PRIME 2016, Oct 2016, Honolulu, United States. pp.129-134, ⟨10.1149/07509.0129ecst⟩
Conference papers hal-01974475v1