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In-situ X-ray mu Laue diffraction study of copper through-silicon viasMicroelectronics Reliability, 2016, 56, pp.78-84. ⟨10.1016/j.microrel.2015.10.008⟩
Journal articles
cea-01849434v1
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3D advanced integration technology for heterogeneous systems3D Systems Integration Conference (3DIC), 2015 International, Aug 2015, Sendai, Japan. ⟨10.1109/3DIC.2015.7334468⟩
Conference papers
hal-01247896v1
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Gap fill enhancement with medium acid electrolyte for the 45nm node and belowAdvanced Metallization Conference 2005, Oct 2005, Colorado Springs, United States. MRS Conference Proceedings, XXI, pp.513-517, 2006
Conference poster
hal-02384376v1
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Ultra Wide Micro Bumps Interconnection Matrix for High Energy Particle Detection: Process and Assembly69th Electronic Components and Technology Conference, May 2019, Las Vegas, United States. pp.1622-1628, ⟨10.1109/ECTC.2019.00249⟩
Conference papers
hal-02475226v1
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