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Atomic and Molecular Layer Deposition Area Selective Deposition using alternate deposition and etch super-cycle strategies.
Marceline Bonvalot
,
Christophe Vallee
,
Cedric Mannequin
,
Moustapha Jaffal
,
Remy Gassilloud
,
et al.
Journal articles
hal-03449134v1
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Gate spacers etching of Si$_3$N$_4$ using cyclic approach for 3D CMOS devices
Valentin Bacquie
,
Aurelien Tavernier
,
Francois Boulard
,
Olivier Pollet
,
Nicolas Posseme
Journal articles
cea-03343549v1
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Elaboration Strategies for Topographically Selective Deposition (TSD) on 3D structures
Taguhi Yeghoyan
,
Moustapha Jaffal
,
Gauthier Lefèvre
,
Gassilloud Rémi
,
Nicolas Posseme
,
et al.
5th Area Selective Deposition Workshop (ASD 2020), Apr 2020, Palo alto, United States
Conference papers
hal-03449258v1
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Topographic Area Selective Deposition (TSD): a comparison between PEALD/q-ALE and PEALD/sputtering approaches
Moustapha Jaffal
,
Taguhi Yeghoyan
,
Vincent Pesce
,
Gauthier Lefevre
,
Ahmad Chaker
,
et al.
7th International Atomic Layer Etching Workshop (ALE 2020), Jun 2020, virtuelle, France. ⟨10.1116/6.0000969⟩
Conference papers
hal-03449336v1
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Precise control of template affinity achieved by UV-assisted graphoepitaxy approach on silicon nanowires applications
Patricia Pimenta-Barros
,
Guillaume Claveau
,
Maxime Argoud
,
Zdenek Chalupa
,
Nacima Allouti
,
et al.
Conference papers
cea-02185301v1
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Challenges of contact etching for 14FDSOI technology
Mokrane Mebarki
,
Maxime Darnon
,
Cecile Jenny
,
Nicolas Posseme
,
Delia Ristoiu
,
et al.
SPIE-AL, Feb 2015, San Jose, United States
Conference papers
hal-02339980v1
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Diagnostics in Pulsed Hydrogen Plasmas
Jerome Dubois
,
Gilles Cunge
,
Nicolas Posseme
,
Maxime Darnon
,
Laurent Vallier
,
et al.
AVS 61st international symposium, Oct 2014, Baltimore, United States
Conference papers
hal-02339983v1
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Characterization and Development of High Dose Implanted Resist Stripping Processes
Marion Croisy
,
Cécile Jenny
,
Claire Richard
,
Denis Guiheux
,
Alain Campo
,
et al.
Journal articles
hal-01882437v1
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Diagnostics in pulsed hydrogen plasmas
Jerome Dubois
,
Gilles Cunge
,
Maxime Darnon
,
Nicolas Posseme
,
Laurent Vallier
,
et al.
11th Frontiers in low temperature plasma diagnostics, May 2015, Hyeres, France
Conference papers
hal-02339976v1
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Interconnects for Tomorrow
Maxime Darnon
,
Nicolas Posseme
Book sections
hal-02339235v1
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Plasma Etch Challenges for Gate Patterning
Maxime Darnon
,
Nicolas Posseme
Book sections
hal-02338426v1
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Optimization of a Topographic Selective Deposition (TSD) route by a super-cycle Atomic Layer Disposition (ALD) / Atomic Layer Etching (ALE)
Moustapha Jaffal
,
Taguhi Yeghoyan
,
Gauthier Lefevre
,
Thierry Chevolleau
,
Rémy Gassilloud
,
et al.
6 ème Workshop RAFALD 2020, Nov 2020, Marseille, France
Conference papers
hal-03449579v1
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Étude de l'intégration des matériaux à très faible permittivité diélectrique dans une structure damascène pour les filières technologiques CMOS
Nicolas Posseme
Micro et nanotechnologies/Microélectronique. Université de Grenoble, 2005. Français. ⟨NNT : ⟩
Theses
tel-00685803v1
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Study of porous SiOCH patterning using metallic hard mask: challenges and solutions
Nicolas Posseme
,
Thibaut David
,
Thierry Chevolleau
,
Maxime Darnon
,
Fanny Bailly
,
et al.
Journal articles
hal-00629313v1
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PMMA removal selectivity to polystyrene using dry etch approach
Aurélien Sarrazin
,
Nicolas Posseme
,
Patricia Pimenta-Barros
,
Sébastien Barnola
,
Ahmed Gharbi
,
et al.
Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics, 2016, 34, pp.061802. ⟨10.1116/1.4964881⟩
Journal articles
hal-01723375v1
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Dry etching study of 3D Grayscale micrometric patterns into a polymer layer
Assia Selmouni
,
Aurélien Tavernier
,
Sébastien Bérard-Bergery
,
Nicolas Posseme
MNE2022 Eurosensors - PESM Workshop, Micro and Nano Engineering, Sep 2022, Leuven, Belgium
Conference papers
cea-03773457v1
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Understanding of a new approach for silicon nitride spacer etching using gaseous hydrofluoric acid after hydrogen ion implantation
Vincent Ah-Leung
,
Olivier Pollet
,
Nicolas Posseme
,
Maxime Garcia Barros
,
Névine Rochat
,
et al.
Journal articles
cea-02202455v1
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New insight into vertical topographical selective deposition of tantalum oxide Ta2O5 by morphological analyses
Gauthier Lefevre
,
Moustapha Jaffal
,
Taguhi Yeghoyan
,
Rémy Gassilloud
,
Nicolas Posseme
,
et al.
Advanced Nanomaterials Congress 2021, Oct 2021, Stockolm, Sweden
Conference papers
hal-03449194v1
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Patterning Challenges in Microelectronics
Sebastien Barnola
,
Nicolas Posseme
,
Stefan Landis
,
Maxime Darnon
Book sections
hal-02338425v1
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Plasma Damage of Porous Low-k Materials
Maxime Darnon
,
Thierry Chevolleau
,
Romain Hurand
,
David Fuard
,
Régis Bouyssou
,
et al.
Material Research Society Spring Meeting, Apr 2014, San Francisco, United States
Conference papers
hal-02338124v1
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Prospects for dielectric constant reduction in integrated circuits interconnects
Maxime Darnon
,
Nicolas Posseme
,
Thierry Chevolleau
,
Thibaut David
Materials Research Society Spring Meeting, Jun 2014, San Francisco, United States. pp.Mrss14-1692-cc01-01, ⟨10.1557/opl.2014.609⟩
Conference papers
hal-02338418v1
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New CH 4 -N 2 dry etch chemistry for poly(methyl methacrylate) removal without consuming polystyrene for lamellar copolymers application
Aurélien Sarrazin
,
Nicolas Posseme
,
Patricia Pimenta-Barros
,
Sebastien Barnola
,
Raluca Tiron
,
et al.
Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics, 2019, 37 (3), pp.030601. ⟨10.1116/1.5090395⟩
Journal articles
hal-02387281v1
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Challenges related to linewidth roughness
Erwine Pargon
,
Laurent Azarnouch
,
Kevin Menguelti
,
Marc Fouchier
,
Melisa Brihoum
,
et al.
China Semiconductor Technology International Conference (CSTIC), Mar 2012, Shanghai, China
Conference papers
hal-02338405v1
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Role of SiCl$_4$ addition in CH$_3$F/O$_2$ based chemistry for Si$_3$N$_4$ etching selectively to SiO$_2$, SiCO and Si
Francois Boulard
,
Valentin Bacquie
,
Aurelien Tavernier
,
Nicolas Posseme
Journal articles
cea-04170423v1
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Topographic Selective Deposition (TSD) by Combining Plasma Enhanced Atomic Layer Deposition and Atomic Layer Etching Processes
Moustapha Jaffal
,
Gauthier Lefevre
,
Taguhi Yeghoyan
,
Thierry Chevolleau
,
Rémy Gassilloud
,
et al.
ALD/ALE 2021 Virtual Meeting Overview - ALD 2021 – AVS, 2021, Virtual Meeting, France
Conference papers
hal-03449379v1
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Characterization of photoresist films exposed to high-dose implantation conditions
Marion Croisy
,
Erwine Pargon
,
Cécile Jenny
,
Claire Richard
,
Denis Guiheux
,
et al.
Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics, 2018, 36 (1), pp.011201
Journal articles
hal-01942735v1
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Thin layer etching of low-k SiCO spacer using hydrogen ion implantation followed by hydrofluoric acid
Nicolas Posseme
,
Maxime Garcia-Barros
,
François Leverd
,
Daniel Benoit
,
Olivier Pollet
,
et al.
Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures, 2018, 36 (5), pp.052201. ⟨10.1116/1.5038617⟩
Journal articles
cea-02185184v1
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Plasma deposition—Impact of ions in plasma enhanced chemical vapor deposition, plasma enhanced atomic layer deposition, and applications to area selective deposition
Christophe Vallee
,
Marceline Bonvalot
,
Samia Belahcen
,
Taguhi Yeghoyan
,
Moustapha Jaffal
,
et al.
Journal articles
hal-02586207v1
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Block copolymer selectivity: A new dry etch approach for cylindrical applications
Aurélien Sarrazin
,
Nicolas Posseme
,
Patricia Pimenta-Barros
,
Sebastien Barnola
,
Ahmed Gharbi
,
et al.
Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures, 2018, 36 (4), ⟨10.1116/1.5034133⟩
Journal articles
hal-01860237v1
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Diagnostics of Pulsed Hydrogen Plasmas
Jerome Dubois
,
Gilles Cunge
,
Olivier Joubert
,
Maxime Darnon
,
Laurent Vallier
,
et al.
67th Gaseous Electronic Conference, Oct 2014, Raleigh, United States
Conference papers
hal-02339984v1
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