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Development of instrumentation for eddy current in situ monitoring of laser powder bed fusionWelding in the World, 2023, 67 (4), pp.1105-1112. ⟨10.1007/s40194-022-01456-5⟩
Journal articles
cea-04089789v1
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Development and adhesion characterization of a silicon wafer for temporary bondingInternational Journal of Adhesion and Adhesives, 2018, 82, pp.100-107. ⟨10.1016/j.ijadhadh.2018.01.007⟩
Journal articles
cea-02186238v1
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