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From epitaxy to converters topologies what issues for 200 mm GaN/Si?
L. Di Cioccio
,
E. Morvan
,
M. Charles
,
P. Perichon
,
A. Torres
,
et al.
2015 IEEE International Electron Devices Meeting (IEDM), Dec 2015, Washington, DC, United States. pp.16.5.1-16.5.4, ⟨10.1109/IEDM.2015.7409712⟩
Conference papers
cea-01839849v1
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Electro-optical characterizations for robustness assessment of automotive qualified white LEDs multichip modules: failure analysis and packaging influence
B. Chambion
,
L. Mendizabal
,
A. Gasse
,
L. Bechou
,
Y. Deshayes
,
et al.
EMPC 2013, Sep 2013, Grenoble, France. pp.Chambion
Conference papers
hal-01019770v1
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Towards Reliable 10 mu m Pitch Assembly Using Cu/Ni/SnAg based Interconnects
D. Taneja
,
M. Volpertl
,
L. Mendizabal
,
T. Chaira
,
D. Henry
,
et al.
2017 IEEE 19TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2017, 345 E 47TH ST, NEW YORK, NY 10017 USA, Unknown Region
Conference papers
hal-01914018v1
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Eclairage Automobile: Les conséquences de l'intégration de DEL blanches de puissance sur la stratégie des tests de fiabilité
B. Chambion
,
L. Mendizabal
,
L. Bechou
,
V. Carreau
,
Y. Deshayes
,
et al.
Journée IMAPS, Oct 2012, Tours, France
Conference papers
hal-00786240v1
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Electro-optical characterizations for robustness assessment of automotive qualified white LEDs multichip modules: failure analysis and packaging influence
B. Chambion
,
L. Mendizabal
,
L. Bechou
,
A. Gasse
,
Y. Deshayes
,
et al.
ISAL Conference, Sep 2013, Darmstadt, Germany. pp.664-673
Conference papers
hal-01022723v1
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