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Adhesion Energy and Bonding Wave Velocity MeasurementsPRIME 2016, Oct 2016, Honolulu, United States. pp.145-152, ⟨10.1149/07509.0145ecst⟩
Conference papers
hal-01974477v1
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Direct Bonding Mechanism of ALD-Al2O3 Thin Films13th International Symposium on Semiconductor Wafer Bonding - Science, Technology and Applications as part of the 226th Meeting of the Electrochem Soc, ECS, Oct 2014, Cancun, Mexico. pp.57-65, ⟨10.1149/06405.0057ecst⟩
Conference papers
hal-02015924v1
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Transmission measurements of multilayer interference filters developed for a full integration on Complementary Metal Oxide Semiconductor chipsThin Solid Films, 2017, 631, pp.23-28. ⟨10.1016/j.tsf.2017.03.055⟩
Journal articles
cea-02202452v1
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Direct Bonding Mechanism of ALD-Al 2 O 3 Thin FilmsECS Journal of Solid State Science and Technology, 2015, 4 (5), pp.P171-P175
Journal articles
hal-02016525v1
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Water Stress Corrosion in Bonded StructuresECS Journal of Solid State Science and Technology, 2015, 4 (5), pp.P124-P130. ⟨10.1149/2.0031505jss⟩
Journal articles
hal-02016558v1
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The beam and detector for the NA48 neutral kaon CP violation experiment at CERNNuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 2007, 574, pp.433-471. ⟨10.1016/j.nima.2007.01.178⟩
Journal articles
in2p3-00145549v1
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Traitement de surface par plasma d'azote dans un procédé de collage directFrance, N° de brevet: 802833. 2008
Patents
hal-01906186v1
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LYAPUNOV EXPONENTS ON METRIC SPACESBulletin of the Australian Mathematical Society, 2018, 97 (1), pp.153-162. ⟨10.1017/S0004972717000703⟩
Journal articles
hal-02496345v1
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(Invited) Water Stress Corrosion in Bonded Structures13th International Symposium on Semiconductor Wafer Bonding - Science, Technology and Applications as part of the 226th Meeting of the Electrochem Soc, Oct 2014, Cancun, Mexico. pp.121-132
Conference papers
hal-02015940v1
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Impact of Water Edge Absorption on Silicon Oxide Direct Bonding EnergyPRIME 2016, Oct 2016, Honolulu, United States. pp.129-134, ⟨10.1149/07509.0129ecst⟩
Conference papers
hal-01974475v1
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