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authFullName_s : B. Mathieu

High performance low temperature FinFET with DSPER, gate last and Self Aligned Contact for 3D sequential mtegration

J. Micout , V. Lapras , P. Batude , C. Fenouillet-Beranger , J. Lacord , et al.
2017 IEEE International Electron Devices Meeting (IEDM), Dec 2017, San Francisco, United States. pp.32.2.1-32.2.4, ⟨10.1109/IEDM.2017.8268484⟩
Conference papers hal-01959097v1

High performance CMOS FDSOI devices activated at low temperature

L. Pasini , P. Batude , J. Lacord , M. Cassé , B. Mathieu , et al.
2016 IEEE Symposium on VLSI Technology, Jun 2016, Honolulu, United States. ⟨10.1109/VLSIT.2016.7573407⟩
Conference papers hal-01730659v1

nFET FDSOI activated by low temperature solid phase epitaxial regrowth: Optimization guidelines

L. Pasini , P. Batude , M. Cassé , L. Brunet , P. Rivallin , et al.
2014 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), Oct 2014, Millbrae, United States. pp.6a.3, ⟨10.1109/S3S.2014.7028214⟩
Conference papers hal-02049393v1

Thermal effects in 3D sequential technology

K. Triantopoulos , M. Cassé , L. Brunet , P. Batude , C. Fenouillet-Beranger , et al.
2017 IEEE International Electron Devices Meeting (IEDM), Dec 2017, San Francisco, United States. pp.7.6.1-7.6.4, ⟨10.1109/IEDM.2017.8268348⟩
Conference papers hal-02050229v1

High performance low temperature activated devices and optimization guidelines for 3D VLSI integration of FD, TriGate, FinFET on insulator

L. Pasini , P. Batude , M. Cassé , B. Mathieu , B. Sklenard , et al.
2015 IEEE Symposium on VLSI Technology, Jun 2015, Kyoto, Japan. pp.T50-T51, ⟨10.1109/VLSIT.2015.7223699⟩
Conference papers hal-02049770v1
Image document

Direct Forcing methods in Trio_U theory and applications

M. Belliard , Clarisse Fournier , Y. Gorsse , C. Introini , B. Mathieu , et al.
Seminaire Trio_U, Jan 2015, Saclay, France
Conference papers cea-02489487v1

Towards 500°C SPER activated devices for 3D sequential integration

J. Micout , B. Sklenard , P. Batude , Rémy Berthelon , Quentin Rafhay , et al.
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), Oct 2017, Burlingame, CA, United States. pp.24.3, ⟨10.1109/S3S.2017.8309220⟩
Conference papers hal-01959113v1

Volume-conserving mesh smoothing for front-tracking methods

Adrien Toutant , B. Mathieu , O. Lebaigue
Computers and Fluids, 2012, 67, pp.16-25. ⟨10.1016/j.compfluid.2012.06.019⟩
Journal articles hal-03404689v1

Smart solutions for efficient dual strain integration for future FDSOI generations

A. Bonnevialle , C. Le Royer , Y. Morand , S. Reboh , C. Plantier , et al.
VLSI Technology, 2016 IEEE Symposium on, 2016, Unknown, Unknown Region. ⟨10.1109/VLSIT.2016.7573406⟩
Conference papers hal-01719489v1
Image document

An analysis and an affordable regularization technique for the spurious force oscillations in the context of direct-forcing immersed boundary methods

Michel Belliard , M. Chandesris , J. Dumas , Y. Gorsse , Dominique Jamet , et al.
Computers & Mathematics with Applications, 2016, 71 (5), pp.1089-1113
Journal articles hal-02047726v1
Image document

DNS of a turbulent steam/water bubbly flow in a vertical channel

G. Bois , B. Mathieu , G. Fauchet , Adrien Toutant
ICMF 2016 - International Conference on Multiphase Flow, May 2016, Florence, Italy
Conference papers hal-02442267v1

3DVLSI with CoolCube process: An alternative path to scaling

P. Batude , C. Fenouillet-Beranger , L. Pasini , V. Lu , F. Deprat , et al.
2015 IEEE Symposium on VLSI Technology, Jun 2015, Kyoto, Japan. pp.T48-T49, ⟨10.1109/VLSIT.2015.7223698⟩
Conference papers hal-02049760v1