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Correlation Between Electromigration-Related Void Volumes and Time-to-Failure by High Resolution X-Ray Tomography and ModelingIEEE Electron Device Letters, 2019, 40 (11), pp.1808-1811. ⟨10.1109/LED.2019.2945089⟩
Journal articles
hal-02879698v1
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Towards the industrial use of synchrotron x-ray nano-tomography for 3D integration failure analysisMaterials Science [cond-mat.mtrl-sci]. Université Grenoble Alpes, 2017. English. ⟨NNT : 2017GREAY088⟩
Theses
tel-01799568v1
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Stability of silver nanowire based electrodes under environmental and electrical stressesNanoscale, 2015, 7 (5), pp.2107-2115. ⟨10.1039/c4nr06783e⟩
Journal articles
cea-03953112v1
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