A quantitative comparison of thermophysical property measurement of CMSX-4® Plus (SLS) in microgravity and terrestrial environments - CEA - Commissariat à l’énergie atomique et aux énergies alternatives Accéder directement au contenu
Article Dans Une Revue High Temperatures-High Pressures Année : 2023

A quantitative comparison of thermophysical property measurement of CMSX-4® Plus (SLS) in microgravity and terrestrial environments

Jannatun Nawer
  • Fonction : Auteur
Takehiko Ishikawa
  • Fonction : Auteur
Hiroshisa Oda
  • Fonction : Auteur
Chihiro Koyama
  • Fonction : Auteur
Hideki Saruwatari
  • Fonction : Auteur
Michael P Sansoucie
  • Fonction : Auteur
Brandon Philips
  • Fonction : Auteur
Markus Mohr
  • Fonction : Auteur
Matthias Kolbe
  • Fonction : Auteur
Douglas M. Matson
  • Fonction : Auteur

Résumé

Density, thermal expansion coefficient, surface tension and viscosity of Ni-based CMSX-4® Plus have been measured for a range of liquid temperature by utilizing two Electrostatic Levitation (ESL) facilities. Ground-based tests were conducted using the NASA Marshall Space Flight Center ESL facility in 1.33 kPa Ultra High Vacuum and space-based tests were conducted using ISS-ELF in 172 kPa Argon gas atmosphere. The measured values were compared to the available literature data. This study focuses on a detailed uncertainty analysis of the experimental data to measure the accuracy and precision of the measured properties using Guide to the expression of Uncertainty Measurement (GUM) principles. The findings from this study have been utilized to quantify the performances of these two ESL facilities in measuring thermophysical properties.
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Dates et versions

cea-04328335 , version 1 (07-12-2023)

Identifiants

  • HAL Id : cea-04328335 , version 1

Citer

Jannatun Nawer, Takehiko Ishikawa, Hiroshisa Oda, Chihiro Koyama, Hideki Saruwatari, et al.. A quantitative comparison of thermophysical property measurement of CMSX-4® Plus (SLS) in microgravity and terrestrial environments. High Temperatures-High Pressures, 2023, 53 (3-4), pp.323-339. ⟨cea-04328335⟩
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