Communication Dans Un Congrès Année : 2024

Investigation of Thermal Resistance Extraction of GaN HEMTs through DCT Measurements Techniques and TCAD-Based Physical Simulations

M. Bouslama
  • Fonction : Auteur
J.C. Jacquet
  • Fonction : Auteur
F. Gaillard
  • Fonction : Auteur
S. Piotrowicz
  • Fonction : Auteur
Raphaël Sommet
J.C. Nallatamby
  • Fonction : Auteur
G. Gauthier
  • Fonction : Auteur

Résumé

In this paper, we extract the thermal resistance (RTH) of an AlGaN/GaN HEMT using a simple approach based on Drain Current Transient (DCT) spectroscopy technique. Previous work confirms that acceptor-like traps present in the Fe-doped GaN buffer are responsible for the drain-lag effect observed in the measurement. The main goal of this work is the use of trap emission time constant which is very sensitive to temperature. The extracted RTH using the new approach was around 13 °C.mm/W. TCAD confirms that the RTH determined using the new measurement approach represents the RTH located around 150 nm under the gate.

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Dates et versions

hal-04920459 , version 1 (30-01-2025)

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M. Bouslama, J.C. Jacquet, F. Gaillard, S. Piotrowicz, Raphaël Sommet, et al.. Investigation of Thermal Resistance Extraction of GaN HEMTs through DCT Measurements Techniques and TCAD-Based Physical Simulations. 2024 19th European Microwave Integrated Circuits Conference (EuMIC), Sep 2024, Paris, France. pp.178-181, ⟨10.23919/EuMIC61603.2024.10732560⟩. ⟨hal-04920459⟩
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